From a long period, the Cupertino- based tech giant, Apple is planning to establish a local assembly unit of iPhone 6s Plus in India. Now, the company has already commenced the trial production of iPhone 6s plus in India which was to be considered one of the best selling smartphones in the country.
As reported by Economic Times Apple Inc’s Taiwanese contract manufacturer Wistron which manufactures Apple smartphones in India begun the trial production of iPhone 6S Plus at tech city Bengaluru. Wistron has established the new assembly for manufacturing of iPhone 6s Plus. It seems that the commercial production of iPhone 6S Plus is likely to start in the coming weeks. The officials stated that the local manufacture of iPhone 6s Plus can bring down the prices of the smartphone by 5-7 percent. If the official's statement turns out to be true then the prices of Apple iPhones could fall in the mid-range segment category.
As reported by Economic Times, a Senior Executive stated, “However, the price correction may not be reflected immediately since Wistron will not be able to fully meet the entire requirement of iPhone 6s Plus in India and imports from China will continue.” He further added that “Eventually, as the local capacity gains scale the prices will get corrected.”
Counterpoint research revealed that, from the total sales of iPhones in India 2017, one- third was the contribution of iPhone 6 series, while less than 15 percent was produced from iPhone SE. iPhone SE is one of the Apple smartphones which is locally assembled in the Wistron plant till now.
The establishment of local assembly unit of iPhone SE helped to bring down the prices of the phone by 6-7 percent. In an aspect to expand sourcing in India, Apple Inc has started communication with its vendors and contract manufacturers namely Flex, Foxconn, and Wistro.
At the time of the announcement of the Union Budget in February 2018, the government had levied a 10 percent customs duty on various components such as printed circuit boards populated with memory and chips, camera modules and connectors.